Manufacturer Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Results:
图片 型号 品牌 库存 封装 描述 询盘
HSE06-503045 HSE06-503045 CUI Devices 7,838 TO-218, TO-220 HEAT SINK, EXTRUSION, TO-218/TO-

立即询盘

NTE498 NTE498 NTE Electronics, Inc 9,891 - HEATSINK FOR PLASTIC PWR

立即询盘

HSE08-505028 HSE08-505028 CUI Devices 5,939 TO-218, TO-220 HEAT SINK, EXTRUSION, TO-218/TO-

立即询盘

V2276E1 V2276E1 Assmann WSW Components 1,499 Top Mount CPU HEATSINK, CROSS CUT, AL6063

立即询盘

HSB27-434316 HSB27-434316 CUI Devices 5,025 BGA HEAT SINK, BGA, 43.1 X 43.1 X 16

立即询盘

ATS-PCB1056 ATS-PCB1056 Advanced Thermal Solutions Inc. 7,305 TO-218, TO-247 HEATSINK TO-218/TO-247 ALUMINUM

立即询盘

HSE02-173213P HSE02-173213P CUI Devices 6,454 - HEAT SINK, EXTRUSION, 17 X 31.9

立即询盘

TGH-0510-01 TGH-0510-01 t-Global Technology 5,354 - ALUMINIUM HEAT SINK 51X35MM

立即询盘

TGH-0280-07 TGH-0280-07 t-Global Technology 7,407 - ALUMINIUM HEAT SINK 28X28MM

立即询盘

NTE448B NTE448B NTE Electronics, Inc 5,973 14-DIP and 16-DIP CLIP-ON H/S FOR 14/16 DIP

立即询盘

RPIHS-01 RPIHS-01 OSEPP Electronics LTD 7,645 Raspberry Pi RASPBERRY PI LOW PROF HEAT SINK

立即询盘

XL25D-TO247-22-17-0.64 XL25D-TO247-22-17-0.64 t-Global Technology 5,308 TO-247 CERAMIC HEAT SPREADER 22X17X0.63

立即询盘

XL25D-TO220-20-14-0.64 XL25D-TO220-20-14-0.64 t-Global Technology 8,606 TO-220 CERAMIC HEAT SPREADER 20X14X0.63

立即询盘

ATS-PCB1037 ATS-PCB1037 Advanced Thermal Solutions Inc. 7,105 TO-220 HEATSINK TO-220 W/TAB BLACK

立即询盘

TGH-0350-03 TGH-0350-03 t-Global Technology 9,710 - ALUMINIUM HEAT SINK 35X35MM

立即询盘

HSE07-753045 HSE07-753045 CUI Devices 7,234 TO-218, TO-220 HEAT SINK, EXTRUSION, TO-218/TO-

立即询盘

TGH-0260-02 TGH-0260-02 t-Global Technology 7,042 - ALUMINIUM HEAT SINK 26X26MM

立即询盘

TGH-0300-03 TGH-0300-03 t-Global Technology 8,509 - ALUMINIUM HEAT SINK 30X30MM

立即询盘

HSE09-755028 HSE09-755028 CUI Devices 6,417 TO-218, TO-220 HEAT SINK, EXTRUSION, TO-218/TO-

立即询盘

V2271E1 V2271E1 Assmann WSW Components 1,449 Top Mount CPU HEATSINK, CROSS CUT, AL6063

立即询盘

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