Manufacturer Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Results:
图片 型号 品牌 库存 封装 描述 询盘
HSB25-282810 HSB25-282810 CUI Devices 9,631 BGA HEAT SINK, BGA, 28.5 X 28.5 X 10

立即询盘

NTE494 NTE494 NTE Electronics, Inc 8,340 TO-220 HEATSINK FOR TO220

立即询盘

HSE01-193175 HSE01-193175 CUI Devices 7,807 - HEAT SINK, EXTRUSION, 19 X 31.5

立即询盘

HSS07-C20-P274 HSS07-C20-P274 CUI Devices 9,014 TO-220 HEAT SINK, STAMPING, TO-220, 21.

立即询盘

HSB23-232325 HSB23-232325 CUI Devices 6,650 BGA HEAT SINK, BGA, 23 X 23 X 25 MM

立即询盘

HSE05-171933 HSE05-171933 CUI Devices 6,209 TO-218, TO-220 HEAT SINK, EXTRUSION, TO-218/TO-

立即询盘

HSE02-173213 HSE02-173213 CUI Devices 6,094 - HEAT SINK, EXTRUSION, 17 X 31.9

立即询盘

ATS-PCB1043 ATS-PCB1043 Advanced Thermal Solutions Inc. 6,847 TO-3 HEATSINK TO-3

立即询盘

ATS-PCB1021 ATS-PCB1021 Advanced Thermal Solutions Inc. 5,950 TO-220 HEATSINK TO-220 DUAL BLACK

立即询盘

NTE411 NTE411 NTE Electronics, Inc 9,211 TO-5, TO-39 HEAT SINK STUD-MOUNT TO5

立即询盘

ATS-PCB1033 ATS-PCB1033 Advanced Thermal Solutions Inc. 8,207 TO-220 HEATSINK CLIP-ON TO-220 W/TAB

立即询盘

V2270E1 V2270E1 Assmann WSW Components 1,035 Top Mount CPU HEATSINK, CROSS CUT, AL6063

立即询盘

V2275E1 V2275E1 Assmann WSW Components 1,318 Top Mount CPU HEATSINK, CROSS CUT, AL6063

立即询盘

HSE01-193175P HSE01-193175P CUI Devices 8,402 - HEAT SINK, EXTRUSION, 19 X 31.5

立即询盘

ATS-PCB1049 ATS-PCB1049 Advanced Thermal Solutions Inc. 7,390 TO-220 HEATSINK TO-220 W/TAB BLACK

立即询盘

NTE406 NTE406 NTE Electronics, Inc 6,746 TO-202 HEAT SINK FOR TO-202 CASE

立即询盘

V2278E1 V2278E1 Assmann WSW Components 1,500 Top Mount CPU HEATSINK, CROSS CUT, AL6063

立即询盘

TGH-0200-06 TGH-0200-06 t-Global Technology 6,558 - ALUMINIUM HEAT SINK 44X20MM

立即询盘

ATS-PCB1059 ATS-PCB1059 Advanced Thermal Solutions Inc. 7,555 TO-220 HEATSINK TO-220 COPPER W/TAB

立即询盘

HSB30-373710 HSB30-373710 CUI Devices 8,101 - HEAT SINK, BGA, 37.4 X 37 X 10 M

立即询盘

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