Manufacturer Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 品牌 库存 封装 描述 询盘
HSB16-404018 HSB16-404018 CUI Devices 6,052 BGA HEAT SINK, BGA, 40 X 40 X 18 MM

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647-10ABEP 647-10ABEP Wakefield-Vette 8,034 TO-220 HEATSINK TO-220 W/PINS BLK 1

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DA-T268-301E-TR DA-T268-301E-TR Ohmite 7,015 TO-268 (D³Pak) HEATSINK FOR TO-268

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580100B00000G 580100B00000G Aavid, Thermal Division of Boyd Corporation 5,975 8-DIP HEATSINK SLIDE-ON 8-DIP

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EA-T220-38E EA-T220-38E Ohmite 8,830 TO-220 HEATSINK FOR TO-220 BLACK

立即询盘

WV-T220-101E WV-T220-101E Ohmite 6,223 TO-220 HEATSINK AND CLIP FOR TO-220

立即询盘

322605B00000G 322605B00000G Aavid, Thermal Division of Boyd Corporation 9,629 TO-5 HEATSINK TO-5 1.25W H=.25 BLK

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E2A-T247-38E E2A-T247-38E Ohmite 9,475 TO-247 BLACK ANODIZED HEATSINK

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530613B00000G 530613B00000G Aavid, Thermal Division of Boyd Corporation 8,490 TO-220 HEATSINK TO-220 BLACK 1.18

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658-35ABT4E 658-35ABT4E Wakefield-Vette 9,023 BGA HEATSINK CPU 28MM SQ BLK W/TAPE

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577202B04000G 577202B04000G Aavid, Thermal Division of Boyd Corporation 9,646 TO-220 HEATSINK TO-220 .500 COMPACT

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V2032B V2032B Assmann WSW Components 6,162 Assorted (BGA, LGA, CPU, ASIC...) HEATSINK CPU FORGED

立即询盘

573400D00010G 573400D00010G Aavid, Thermal Division of Boyd Corporation 6,872 TO-268 (D³Pak) HEATSINK D-PAK3 TIN PLATED SMD

立即询盘

FIT0818 FIT0818 DFRobot 5,877 Raspberry Pi 4B BLACK ALUMINUM HEATSINKKIT FOR R

立即询盘

658-45ABT3 658-45ABT3 Wakefield-Vette 8,766 BGA HEATSINK CPU 28MM SQ BLK W/TAPE

立即询盘

M48079B011000G M48079B011000G Aavid, Thermal Division of Boyd Corporation 6,202 TO-126, TO-220, TO-247 MAX CLIP HEATSINK

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HSB17-404025 HSB17-404025 CUI Devices 9,712 BGA HEAT SINK, BGA, 40 X 40 X 25 MM

立即询盘

374324B00035G 374324B00035G Aavid, Thermal Division of Boyd Corporation 9,954 BGA, FPGA HEATSINK BGA W/ADHESIVE TAPE

立即询盘

573300D00000G 573300D00000G Aavid, Thermal Division of Boyd Corporation 5,633 TO-263 (D²Pak) TOP MOUNT HEATSINK .4 D2PAK

立即询盘

501100B00000G 501100B00000G Aavid, Thermal Division of Boyd Corporation 8,307 14-DIP and 16-DIP HEATSINK 14-DIP/16-DIP

立即询盘

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