Manufacturer Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 品牌 库存 封装 描述 询盘
HSB18-232310 HSB18-232310 CUI Devices 5,324 BGA HEAT SINK, BGA, 23 X 23 X 10 MM

立即询盘

V2029B V2029B Assmann WSW Components 7,757 Assorted (BGA, LGA, CPU, ASIC...) HEATSINK CPU XCUT

立即询盘

V2269E1 V2269E1 Assmann WSW Components 1,223 Top Mount CPU HEATSINK, CROSS CUT, AL6063

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HSE-B20254-035H HSE-B20254-035H CUI Devices 10,245 TO-220 HEAT SINK, EXTRUSION, TO-220,25.

立即询盘

508500B00000G 508500B00000G Aavid, Thermal Division of Boyd Corporation 7,812 24-DIP HEATSINK 24-PIN DIP GLUE-ON BLK

立即询盘

576802B00000G 576802B00000G Aavid, Thermal Division of Boyd Corporation 5,791 TO-220, TO-262 HEATSINK TO-220 5W BLK

立即询盘

HSE-B250-04H HSE-B250-04H CUI Devices 5,521 TO-220 HEAT SINK, EXTRUSION, TO-220, 25

立即询盘

V7466Y V7466Y Assmann WSW Components 5,231 SOT-32, TO-220, TOP-3 HEATSINK ALUM ANOD

立即询盘

542502D00000G 542502D00000G Aavid, Thermal Division of Boyd Corporation 9,593 TO-220 HEATSINK TO-220 TAB TIN

立即询盘

HSS03-B20-P318 HSS03-B20-P318 CUI Devices 7,273 TO-220 HEAT SINK, STAMPING, TO-220, 41.

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575102B00000G 575102B00000G Aavid, Thermal Division of Boyd Corporation 7,586 TO-220 HEATSINK TO-220 CLIP-ON BLK

立即询盘

577002B04000G 577002B04000G Aavid, Thermal Division of Boyd Corporation 6,111 TO-220 HEATSINK TO-220 W/TAB .25

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651-B 651-B Wakefield-Vette 7,797 14-DIP and 16-DIP HEATSINK 14-16PIN DIP BLK

立即询盘

PB1-36CB PB1-36CB CTS Thermal Management Products 5,655 TO-126, TO-127, TO-220 HEATSINK VERT .50H BLK TO-220

立即询盘

576602B00000G 576602B00000G Aavid, Thermal Division of Boyd Corporation 9,883 TO-220 HEATSINK TO-220 VERT MNT .95

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ATS-PCB1029 ATS-PCB1029 Advanced Thermal Solutions Inc. 7,451 TO-220 HEATSINK TO-220 BLACK

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HSB11-252518 HSB11-252518 CUI Devices 7,606 BGA HEAT SINK, BGA, 25 X 25 X 18 MM

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658-60AB 658-60AB Wakefield-Vette 5,678 BGA HEATSINK CPU 28MM SQ BLK W/OTAPE

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V5619B V5619B Assmann WSW Components 5,570 24-DIP HEATSINK ALUM ANOD

立即询盘

V-1102-SMD/A-L V-1102-SMD/A-L Assmann WSW Components 5,819 TO-263 (D²Pak) HEATSINK TO-263 19.38X25.40MM

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