Manufacturer Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 品牌 库存 封装 描述 询盘
342940 342940 Aavid, Thermal Division of Boyd Corporation 1,627 BGA COPPER HEATSINK 38.5X37.6X14MM

立即询盘

40532 40532 Vicor Corporation 1,339 - BOM ASSY 4623 LF PUSHPIN HTSNK

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DHS-B9292-04A DHS-B9292-04A Delta Electronics 4,812 LGA HEATSINK ASSY INTEL LGA2011

立即询盘

40141 40141 Vicor Corporation 3,046 - BOM, ASSEMBLY, 6123 XF PUSH PI

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TXP050822B TXP050822B CTS Thermal Management Products 3,794 - HEAT SINK ELECT ISO TO-5 W/HRDWR

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40533 40533 Vicor Corporation 4,830 - BOM ASSY 6123 XF PUSHPIN HTSNK

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40534 40534 Vicor Corporation 3,772 - BOM ASSY 6123 LF PUSHPIN HTSNK

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342943 342943 Aavid, Thermal Division of Boyd Corporation 3,368 BGA COPPER HEATSINK 50X50X14MM

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FHS-A6025B02A FHS-A6025B02A Delta Electronics 4,525 Intel LGA2011 Cooler FAN CPU COOLER 91.5X91.5MM 12VDC

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7-1542004-1 7-1542004-1 TE Connectivity AMP Connectors 3,522 BGA HTS93-A=HS ASSY AL CLIP

立即询盘

342947 342947 Aavid, Thermal Division of Boyd Corporation 3,035 BGA COPPER HEATSINK 57.9X59X11MM

立即询盘

FHS-K8020S00 FHS-K8020S00 Delta Electronics 3,611 Intel LGA1155 CPU Cooler FAN CPU COOLER 80X22MM 12VDC

立即询盘

KK0808-03 KK0808-03 Trenz Electronic GmbH 3,949 MPSoC TE0808 HEAT SPREADER FOR MPSOC TE0808

立即询盘

40519 40519 Vicor Corporation 3,911 - BOM ASSY 4623 DUAL HTSNK 11MM

立即询盘

ACC-HS3-SET ACC-HS3-SET Enclustra FPGA Solutions 2,712 - ACC HEATSINK ME ACC-HS3

立即询盘

1542009-2 1542009-2 TE Connectivity AMP Connectors 4,825 BGA HEAT SINK ASSY 29MM

立即询盘

3-1542006-3 3-1542006-3 TE Connectivity AMP Connectors 2,990 - V-2461 = 47.5MM HS ASSY ALUM C

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342948 342948 Aavid, Thermal Division of Boyd Corporation 3,474 BGA COPPER HEATSINK 70X69X14MM

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435AAAA 435AAAA Wakefield-Vette 3,402 - HEAT SINK, B4547AAAA REV

立即询盘

125380 125380 Wakefield-Vette 1,589 Power Modules 5WX36 EXTRUSION 16414 XX7332

立即询盘

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