Manufacturer Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 品牌 库存 封装 描述 询盘
HSE-B20381-040H HSE-B20381-040H CUI Devices 9,299 TO-220 HEAT SINK, EXTRUSION,TO-220, 38.

立即询盘

625-35AB 625-35AB Wakefield-Vette 7,922 BGA HEATSINK FOR 25MM BGA

立即询盘

HSE-B18381-035H HSE-B18381-035H CUI Devices 6,711 TO-218 HEAT SINK, EXTRUSION, TO-218, 38

立即询盘

630-35AB 630-35AB Wakefield-Vette 9,793 BGA HEATSINK FOR 35MM BGA

立即询盘

CSM221-12AE CSM221-12AE Ohmite 8,831 TO-220 HEATSINK BLACK ANODIZED

立即询盘

642-60AB 642-60AB Wakefield-Vette 9,779 BGA HEATSINK FOR 35MM BGA

立即询盘

529901B00000 529901B00000 Aavid, Thermal Division of Boyd Corporation 7,399 TO-218 BOARD LEVEL HEAT SINK

立即询盘

625-35ABT3 625-35ABT3 Wakefield-Vette 7,662 BGA HEATSINK FOR 25MM BGA

立即询盘

529902B02100G 529902B02100G Aavid, Thermal Division of Boyd Corporation 6,111 TO-220 BOARD LEVEL HEAT SINK

立即询盘

HSE-B18635-035H-04 HSE-B18635-035H-04 CUI Devices 7,572 TO-218 HEAT SINK, EXTRUSION, TO-218, 63

立即询盘

642-25ABT3 642-25ABT3 Wakefield-Vette 9,527 BGA HEATSINK FOR 35MM BGA

立即询盘

533722B02552G 533722B02552G Aavid, Thermal Division of Boyd Corporation 9,920 TO-220 (Dual) HEAT SINK

立即询盘

624-60AB 624-60AB Wakefield-Vette 6,019 BGA HEATSINK FOR 21MM BGA

立即询盘

659-65AB 659-65AB Wakefield-Vette 5,336 BGA HEATSINK EXTRUSION 37MM

立即询盘

HSE-B20508-035H-W HSE-B20508-035H-W CUI Devices 8,622 TO-220 HEAT SINK, EXTRUSION, TO-220, 50

立即询盘

V2136N1-F-LP V2136N1-F-LP Assmann WSW Components 7,103 Assorted (BGA, LGA, CPU, ASIC...) HEATSINK CPU W/ADHESIVE STAMPED

立即询盘

HSE-B20635-035H HSE-B20635-035H CUI Devices 9,648 TO-220 HEAT SINK, EXTRUSION, TO-220, 63

立即询盘

HSE-B20635-035H-01 HSE-B20635-035H-01 CUI Devices 6,931 TO-220 HEAT SINK, EXTRUSION, TO-220, 63

立即询盘

V2201N1-F V2201N1-F Assmann WSW Components 5,711 Assorted (BGA, LGA, CPU, ASIC...) HEATSINK CPU W/ADHESIVE STAMPED

立即询盘

HSE-B18254-035H-00 HSE-B18254-035H-00 CUI Devices 14,230 TO-218 HEAT SINK, EXTRUSION, TO-218, 25

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