Manufacturer Packaging Series ProductStatus Type Size/Dimension UsableTemperatureRange Color ThermalConductivity Features ShelfLife

























































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
图片 型号 品牌 库存 封装 描述 询盘
8349TFM-25ML 8349TFM-25ML MG Chemicals 2,595 THERMAL ADHESIVE 25ML

立即询盘

65-00-TC50-0010 65-00-TC50-0010 Parker Chomerics 3,111 THERM-A-GAP TC50 5.2W/M-K 10CC

立即询盘

8329TFS-50ML 8329TFS-50ML MG Chemicals 2,771 SLOW CURE THERM COND ADH FLOW

立即询盘

A17170-01 A17170-01 Laird Technologies - Thermal Materials 3,521 TPUTTY 508

立即询盘

1379310 1379310 LOCTITE 4,294 CATALYST 9 (27G)

立即询盘

65-02-GEL75-0030 65-02-GEL75-0030 Parker Chomerics 1,907 THERM-A-GAP GEL 75 7.5 W/M-K DIS

立即询盘

TG-NSP25-60 TG-NSP25-60 t-Global Technology 3,652 SILICONE FREE THERMAL PUTTY 60CC

立即询盘

1978-1 1978-1 Techspray 3,542 SILICONE FREE HEAT SINK

立即询盘

832TC-450ML 832TC-450ML MG Chemicals 1,754 THERMALLY CONDUCTIVE EPOXY

立即询盘

65-00-T670-0080 65-00-T670-0080 Parker Chomerics 1,143 T670 3W/M-K GREASE 80CC JAR

立即询盘

TG-N909-1000 TG-N909-1000 t-Global Technology 2,526 NON-SILICONE THERMAL GREASE 1KG

立即询盘

1586134 1586134 LOCTITE 3,883 ECCOBOND 56C-CAT 9 KIT, 140.5GM

立即询盘

TC3-10G TC3-10G Chip Quik Inc. 3,456 HEAT SINK THERMAL COMPOUND

立即询盘

65-00-T630-0300 65-00-T630-0300 Parker Chomerics 3,583 THERM-A-GAP T630 0.7W/M-K 300CC

立即询盘

P0200-19 P0200-19 Littelfuse Inc. 7,784 HEAT SINK COMP. SARAN PKG 2GR

立即询盘

HSC67-6G HSC67-6G CAIG Laboratories, Inc. 5,201 SILICONE HEAT SINK COMPOUND SQUE

立即询盘

TC3-1G TC3-1G Chip Quik Inc. 7,655 HEAT SINK THERMAL COMPOUND

立即询盘

TC1-10G TC1-10G Chip Quik Inc. 7,670 HEAT SINK COMPOUND - HIGH DENSIT

立即询盘

BT-102-50M BT-102-50M Wakefield-Vette 4,851 TOUGHENED, FLEXIBLE ADHESIVE SYS

立即询盘

BT-101-50M BT-101-50M Wakefield-Vette 4,885 NON-SAG 5 MINUTE BONDATHERM EPOX

立即询盘

Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • 首页

    首页

    产品

    产品

    应用

    应用

    联系

    联系