| Manufacturer | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
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| 图片 | 型号 | 品牌 | 库存 | 封装 | 描述 | 询盘 |
|---|---|---|---|---|---|---|
|
HS14 | Apex Microtechnology | 4,123 | TO-3 | HEATSINK 8P TO-3 1.7C/W |
立即询盘 |

